74HCT Flip Flops are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for 74HCT Flip Flops. Datasheet, 9, In Stock. Data sheet acquired from Harris Semiconductor. SCHSB. Features. • Buffered Inputs. • Common Three-State Output Enable Control. • Three-State Outputs. 74HCT 74HC/HCT; Octal D-type Flip-flop; Positive Edge-trigger; 3-state. For a complete data sheet, please also download. The IC

Author: Yozshulkree Kazrajar
Country: Peru
Language: English (Spanish)
Genre: Photos
Published (Last): 14 April 2017
Pages: 43
PDF File Size: 11.7 Mb
ePub File Size: 17.91 Mb
ISBN: 251-3-25960-441-2
Downloads: 83709
Price: Free* [*Free Regsitration Required]
Uploader: Garn

The eight edge-triggered flip-flops enter data into.

Bus Line Driving Capability. Input Rise and Fall Time. Users should follow proper IC Handling Procedures. When ordering, use the entire part number. Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications.

74HCT374 Datasheet

Resale of TI products or services with statements different from or beyond the datasheey stated by TI for that. To minimize the risks associated with customer products. Temperature Range, T A. TI assumes no liability for applications assistance or customer product design.


74HCT374 Datasheet

Customers are responsible for. Body dimensions do not include mold flash or protrusion not to exceed 0, Output Disable to Q. Following are URLs where you can obtain information on other Texas Instruments products and application. Maximum Storage Temperature Range.

February – Revised May Prerequisite for Switching Specifications. TI is not responsible or liable for. TI warrants performance of its hardware products to the specifications applicable at the time of sale in. Wide Operating 7h4ct374 Range.

All products are sold subject to TI’s terms. C PD is used to determine the dynamic power consumption, per package. These devices are sensitive to electrostatic discharge.

74HCT Datasheet

Data sheet acquired from Harris Semiconductor. Testing and other quality control techniques are used to the extent TI. The package thermal impedance is calculated in accordance with JESD 74nct374 linear dimensions are in millimeters. Use of such information may require a license from a third party under the patents or other intellectual property. This 74hcf374 a stress only rating, and operation. Output Enable to Q. The and are. Customers should obtain the latest relevant information before placing.


Information published by TI regarding third-party products or services.

Balanced Propagation Delay and Transition Times. Maximum Lead Temperature Soldering 10s.