IPC Design and Assembly Process Implementation for Ball Grid Arrays ( BGAs). IPCC delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the. Lead-free solder has numerous undesirable characteristics, such as a higher melting point and reduced wetting than its leaded predecessor.
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It is worth noting that voids are not new to BGAs. The shock often causes BGA connections to separate.
IPC-7095C Focuses on Changes in BGA Manufacturing
The prevalence of handhelds prompted committee members to focus on the problems that come when small products are dropped. IPC 0795 using a tool called SurveyMonkey. These revisions were driven in large part by customer concerns. Further analysis revealed a fault known as cratering, in which the resin under the copper starts to fracture. Another issue that is covered in detail is head on pillow. The other area that needs to be revisited is design of land patterns for BGAs. If you participate in the survey, we will provide you with a summary of answers from industry colleagues regarding the use of BGA components.
There have been concerns raised in the industry, and it was highly recommended in IPC that solder mask-defined lands are undesirable because they impact reliability adversely. However, leaded surface mount and thru-hole component solder joints usually are visually inspected, not X-rayed.
Before proceeding with our next revision to IPCwe will conduct a survey, and you can help shape the next revision. Number of pages As the chairman of this committee, I invite and welcome your input to help shape this important industry document. Another change in the latest iteration of IPC is that voids in solder joints, although still a concern based on their location, have become more of a process indicator.
For example, there are two common approaches for designing lands for BGA – solder mask-defined and non-solder mask, or copper, defined.
The demand for high density is increasing the number of terminations and driving lead spacing to smaller dimensions. The target 0795 for this document are managers, designers and process engineers who are responsible for design, assembly, inspection and repair processes of printed boards and printed board assemblies. Originally, many thought kpc these open circuits were in the solder joint or were caused by peeling copper.
Your answers will be summarized. Techniques for controlling temperatures and improving solder reflow are also covered. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.
As manufacturers and OEMs grapple with the challenges faced using BGAs with high lead counts and fine pitches, IPC is providing guidance for dealing with this high density.
There are many reasons ipcc this phenomenon, which stems from new laminate formulations to address the higher lead-free temperatures and thinner layers at the surface creating less resin over the glass reinforcement. Specific solder alloy requirements are addressed for users who are attaching dissimilar package materials. The base document has ipv an extensive revision during a lengthy development by the committee that included a wide range of representatives from OEMs to fabricators to EMS companies.
Ball grid arrays are a dominant interconnection technology for the semiconductors used in many of the handheld portable products. Ray Prasad of Prasad Consultancy Group spearheaded the effort. Based on the input of this committee, I am glad to report that IPC D has been updated to include void-acceptance criteria.
When the committee was working on the new C revision, we reviewed the B rev paragraph by paragraph. Additionally, he is president of BeamWorks Inc. The standard takes another look at X-ray inspection techniques, which have vastly improved and are often used to examine solder connections that are ioc the package.
Design and Assembly of BGAs and Voiding Requirements: IPC B
Based on this data, some people have advocated that voids are good for reliability. It is a condition where reflowed solder ball and reflowed solder paste do not coalesce forming an incomplete bond that is unreliable. If similar inspections are done for other types of components, voids definitely will be seen.
The incredible popularity of compact, handheld products brings a number of iipc challenges for designers and manufacturers. In BGAs, however, we cannot see the joints visually because they are hidden under the package, making X-ray a common inspection method.
Design and Assembly of BGAs and Voiding Requirements: IPC 7095 B
Voids are seen in thru-hole 7059 other surface mount joints. This standard describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. The intent is to provide useful and practical information to the industry. Common causes include contamination, ball or solder paste oxidation, and board warpage. Their focus on end product reliability prompted the creation of new information that focuses on mechanical as well as thermal stresses.
A range of processes have been examined so the standard can give users the latest information on best practices. The combination of all the issues drove the development of the C revision to the BGA implementation standard. IPCD describes design and assembly implementation for ball grid array BGA and fine-pitch BGA FBGA technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.
The miniaturization of these products has altered the reliability consideration as designers have to consider the shock that jpc when products are inevitably dropped. Target audiences 709 this document are managers, design and process engineers, as well opc operators and technicians who deal with electronics assembly, inspection and repair processes.
The critical issue of black pad associated with electroless immersion pic gold ENIG has been described in detail. The other area that has received considerable attention in this revision is BGA rework using hot air and laser methods, as well as ways to prevent damage to adjacent components.
The recommendations for process improvement have been retained and are now in the Appendix of the document.